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Western Digital aim to reach a merger agreement with Kioxia Holdings by August 7/18/2023 The deal would be structured as a tax-free spinoff of Western Digital’s flash business, which would merge with Kioxia, Western Digital shareholders would own slightly more than 50% of the merged entity Chips executives headed for DC to discuss China policy 7/18/2023 The executives plan to hold meetings with U.S. officials to talk about market conditions, export controls and other matters affecting their businesses, Total semiconductor manufacturing equipment sales projected contraction of 18.6% to $87.4 billion in 2023 7/17/2023 The expected 2024 recovery—to $100 billion—will be driven by both the front-end and back-end segments. Biometric hardware devices are set to reach $9 billion worldwide by 2027 7/17/2023 Consumer electronics—smartphone, tablet, wearable—biometric capability will markedly increase in future years. Fingerprint sensor revenues will remain at a steady $1.5 billion annually, with attach rates for face, voice, vein, ECG, and gesture biometrics increasing rapidly. AOS Announces New 650V and 750V Automotive aSiC MOSFETs for Industrial and Electric Vehicle Applications 7/17/2023 The 650V SiC MOSFETs are ideal switching solutions for industrial applications such as solar inverters, motor drives, industrial power supplies, and new energy storage systems, while the AEC-Q101 qualified 750V SiC MOSFET line is targeted for the high-reliability needs in electric vehicle (EV) systems such as the on-board charger (OBC) and the main traction inverter. Microchip Launches Automotive-qualified 10BASE-T1S Ethernet Devices 7/17/2023 Microchip's automotive-qualified Ethernet PHYs are functional safety ready and designed for use in ISO 26262 applications. Infineon Partners with Teledyne e2v on Processor Solutions for Edge Computing Space Systems 7/14/2023 Built around a Teledyne e2v QLS1046-Space edge computing module configured by the rad-hard Infineon SONOS based NOR Flash memory, enables high performance space processing applications. Infineon Technologies Extended AI Capabilities for Bluetooth LE MCU 7/14/2023 Developers of AI-enabled IoT applications can now also build edge Machine Learning (ML) applications using the Edge Impulse Studio environment for deployment on high-performance, low-power PSoC 63 Bluetooth LE MCUs. Design Automation Conference (DAC 2023) kicks off at the Moscone Center in San Francisco 7/14/2023 AI’s infiltration into many industries, including electronics engineering, is driving the growth of semiconductor consumption, the rise of domain-specific computing, the re-emergence of vertical integration and greater opportunity for EDA companies. AI Can't Design Chips Without People 7/14/2023 AI needs human domain expertise to solve chip design challenges. Microsoft Prevails Over FTC: US Judge Denies Bid to Block Activision Deal 7/13/2023 Although the EU already approved the acquisition, Microsoft still has to deal with regulators in the UK, who blocked the deal on concerns the merger will undermine competition. Microsoft President Brad Smith is now indicating the company is ready to negotiate with the UK's Competition and Markets Authority to a compromise. Electronic system design (ESD) industry revenue increased by 12% from in the first quarter of 2023 7/13/2023 “The electronic design automation (EDA) industry continued to post double-digit gains in Q1 2023, with increases in all product categories and geographic regions,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. Infineon Partners with Teledyne e2v on Processor Solutions for Edge Computing Space Systems 7/13/2023 Infineon Technologies AG and Teledyne e2v have developed a reference design for the implementation of compute-intensive space systems. The design, built around a Teledyne e2v QLS1046-Space edge computing module, which is configured by the radiation-hardened 64MB Infineon SONOS based NOR Flash memory, Applied Materials offers New Hybrid Bonding and TSV Technologies Advance Heterogeneous Chip Integration 7/13/2023 Applied Materials Inc. has extended its technologies for heterogeneous integration (HI) by launching materials, technologies and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). DRAM ASP Decline Narrows for Q3 Amid Production Cuts, Seasonal Demand 7/12/2023 In line with this, TrendForce projects that the third quarter will see the average selling price (ASP) for DRAM converging towards a 0~5% decline. Despite suppliers’ concerted efforts, inventory levels persistently remain high, keeping prices low. Keysight PathWave Design 2024 Features Automation, Collaboration Support for EDA Workflows 7/12/2023 Keysight's PathWave Design 2024 gives design engineers new software automation, design data and IP management, team collaboration, and development lifecycle transformation capabilities. Stellantis N.V. and Foxconn created JV to design and sell semiconductors to the automotive industry 7/12/2023 The JV combines Foxconn’s development capabilities and domain expertise in the ICT industry with Stellantis’ deep understanding of diverse mobility needs around the world. SiliconAuto will provide customers an auto industry-centric source of semiconductors for the growing number of computer-controlled features and modules, particularly those needed for electric vehicles. An evolution in next-gen data centers could replace digital circuits 7/12/2023 LLMs like OpenAI’s ChatGPT have suddenly become prevalent in everyday conversations, as the sophistication of the “chatbot” has seemed to have crossed a threshold of conversational capability. The potential for integration of this technology into various services is seemingly limitless. Renesas' clock driver ICs to support DDR5 server and client DIMM modules at speeds up to 6400MT/s 7/11/2023 Renesas’ Gen 3 DDR5 RCD is designed for registered DIMMs (RDIMMs). The CKD supports speeds up to 7200MT/s and is the first in the industry to interface with small-outline DIMMs (SODIMMs), unbuffered DIMMs (UDIMMs), high-performance gaming DIMMs, and memory down applications for client platforms. Wireless Combo Chips Enable Matter Protocol in Smart Homes 7/11/2023 These chips will grow more powerful in their quest to efficiently serve wireless technologies. Siemens Digital Software unveiled a range of new certifications with longtime partner Samsung Foundry 7/11/2023 These product certifications enable key achievements when using Siemens EDA technologies for the foundry’s latest process technologies. 5G Advanced RF design 7/11/2023 5G Advanced, will bring higher bandwidth, lower latency and higher energy efficiency to applications like enhanced mobile broadband, massive IoT and edge computing. While these are big benefits for mobile network operators, it is causing RF and component design challenges. Renesas and Wolfspeed Ink 10-Year SiC Wafer Supply Agreement 7/10/2023 The wafer supply agreement with Wolfspeed will provide Renesas with a stable, long-term supply base of high-quality SiC wafers. SCHURTER Touchless Switch Enables Invisible Installation 7/10/2023 SCHURTER THS: the Touchless Hidden Switch, which can be installed almost invisibly from behind. Just a tiny cut-out in the user interface is all that is needed and the ToF sensor reliably does its job. Microchip Technology Inc. is investing around $300 million in expanding its operations in India 7/10/2023 “Microchip is making a significant strategic commitment to growing our operations in India, whose meteoric growth has established it as one of the top sources of business and technical resources in our sector,” said Ganesh Moorthy, President and CEO of Microchip.  50  |  51  |  52  |  53  |  54  |  55  |  56  |  57  |  58  |  59

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