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IBM, Rapidus working together on chiplet packaging |
6/6/2024 |
IBM and Japanese startup Rapidus are collaborating on packaging technology for Rapidus' 2-nanometer manufacturing process. The partnership is part of Japan's New Energy and Industrial Technology Development Organization's project on the development of chiplet technology.
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Nvidia not ready to sign off on Samsung's HBM chips |
6/6/2024 |
Jensen Huang says Samsung Electronics' high-bandwidth memory chips are not ready for certification, citing the need for more engineering work. Huang has been making a splash in public appearances in Taiwan during the Computex tech trade fair.
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Qualcomm: The PC Reborn |
6/6/2024 |
Qualcomm Snapdragon powered Windows Copilot+ PCs at the forefront of technology innovation. Together, we are redefining the personal computing experience, and enabling developers to efficiently create apps for this new generation,”
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Strong AI Server Demand to Fuel MLCC Shipment Growth in 2Q |
6/5/2024 |
AI server orders and stable ICT product demand—despite not seeing high seasonal growth—are helping stabilize production capacity utilization in the second quarter. As a result, MLCC shipments are projected to increase by 6.8% to reach 1.2345 trillion units, which will also drive slight revenue growth in the same period, according to TrendForce.
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NAND revenues forecast to be up 10% in Q2 |
6/3/2024 |
The surge in large enterprise SSD orders continues to drive up the ASP of NAND Flash by 15%. TrendForce forecasts Q2 NAND revenue to increase by nearly 10% QoQ.
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Malaysia seeks over $107B in chip investment |
5/29/2024 |
Malaysia is aiming to increase its role in the global semiconductor supply chain and is targeting more than $107 billion in investments in advanced packaging, manufacturing equipment and integrated circuit design, according to Prime Minister Anwar Ibrahim. Malaysia expects to contribute $5.3 billion to meet the targets.
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HBM Prices to Jump 5–10% in 2025 |
5/28/2024 |
HBM’s share of total DRAM bit capacity is estimated to rise from 2% in 2023 to 5% in 2024 and surpass 10% by 2025. In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025.
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