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Samsung to unveil 280-layer QLC NAND flash memory chip |
2/6/2024 |
Samsung Electronics is set to debut new products at the International Solid-State Circuits Conference, including its record-setting 280-layer QLC V9 NAND flash memory chip. The technology boasts a 3.2Gb/s transfer speed and could lead to solid-state drives with higher capacity and more affordable pricing.
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SK Hynix set to pick Ind. instead of Ariz. for $15B packaging plant |
2/6/2024 |
The project will be a significant step forward for advanced packaging in the U.S., which has become a bottleneck in Washington’s efforts to revitalize the domestic semiconductor industry. The U.S. has only 3% of the world’s packaging capacity, meaning that firms manufacturing chips in America have to ship them to Asia to be assembled for use.
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