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South Korea to crack down on chip technology leaks 8/29/2023
South Korea plans to bolster regulations and sentencing around technology leaks for chips and displays as the country looks to keep ahead of competitors. Details on stricter punishments and sentencing guidelines will likely be released next
Sony Semiconductor to Launch Large-size, HD 1.3-type 4K OLED Microdisplay 8/29/2023
The new OLED Microdisplay is mainly intended for virtual reality (VR) and augmented reality (AR) head-mounted display applications. It delivers 4K resolution with a 1.3-type large-size display by employing miniaturization processes that SSS has achieved while developing camera electronic viewfinders (EVFs), as well as its own pixel drive circuits.
AMD's Lisa Su Receives Distinguished Executive Leadership Award from JEDEC 8/29/2023
The JEDEC Board of Directors presented its prestigious 2023 Distinguished Executive Leadership Award to AMD Chair and CEO Dr. Lisa T. Su.
AI workloads will represent a $53.4 billion revenue opportunity for the semiconductor industry in 2023 8/28/2023
“The developments in generative AI and the increasing use of a wide range AI-based applications in data centres, edge infrastructure and endpoint devices require the deployment of high performance graphics processing units (GPUs) and optimised semiconductor devices. This is driving the production and deployment of AI chips,”
Arm is seeking high profile IPO investors 8/28/2023
It remains to be seen if rumors that tech giants such as Intel, Nvidia, Apple or Amazon, plan to invest in Arm will come to fruition.
Infineon Expands CoolSiC MOSFET Family with 650V Device in TOLL Package 8/28/2023
The new SiC MOSFETs enhance Infineon’s comprehensive CoolSiC portfolio and are optimized for the lowest losses and the highest reliability.
SCHURTER Leading the Way Towards Greener Electronics Manufacturing 8/28/2023
SCHURTER's Green Line portfolio underscores its commitment to creating sustainable electronics to help decarbonize the industry.
Synopsys acquired PikeTec for its automotive testing software 8/25/2023
PikeTec is a provider of testing and verification solutions for automotive software used in control unit systems. The strategic acquisition positions Synopsys as a key player in addressing the growing challenges faced by the automotive industry in testing and verifying software-defined vehicles
Qualcomm updates Snapdragon chips for gaming 8/25/2023
Qualcomm is following up its Snapdragon G3x with three chips for handheld and mobile gaming: Snapdragon G3x Gen 2, G1 and G2. The G3x's central processing unit is 30% faster than its previous version, and the graphics processing unit has double the speed,
Synopsys Completes Acquisition of PikeTec 8/25/2023
Synopsys has completed the acquisition of test automation tool provider PikeTec.
PRIME Enters Automotive Sector 8/25/2023
FIC Global subsidiary PRIME recently implemented an independent strategic approach to establish its presence in the automotive industry.
Nvidia offers AI-ready servers to ease deployment 8/24/2023
Nvidia is helping companies adopt generative AI with AI-ready servers featuring L40S graphics processing units, AI Enterprise software and BlueField-3 data processing units. The company is also debuting DLSS 3.5 in the coming months with Ray Reconstruction for next level ray tracing.
Not all CEOs are concerned about climate changes 8/24/2023
A survey from PwC found half of CEOs report climate change as a threat to business, yet less than a quarter have plans for re.ated disruptions in the next 12 to 18 months. Nineteen percent of executives said climate is a significant risk,
Samsung goes for localized sourcing 8/24/2023
According to Korean media outlet ET News, Samsung increased its suppliers from 100 in 2022 to 113 in 2023, and among the 13 additional suppliers added, 11 are based in South Korea. Overall, 59, or 52.2% of Samsung's suppliers, are Korea-based, more than that in the past two years.
Intel aims to quadruple capacity for its most advanced chip packaging services facility in Malaysia 8/24/2023
The factory being built in Penang will be Intel's first overseas facility for advanced 3D chip packaging, what it calls Foveros technology. The company is also building an additional chip assembly and testing factory in Kulim as part of a $7 billion expansion in the Southeast Asian nation.
High paying jobs aare offered to workers with machine learnings 8/23/2023
Netflix recently posted a position paying as much as $900,000 for someone with extensive experience working with machine learning platforms. Nvidia has postings paying in the $400,000 range. Meta, Microsoft, and Alphabet’s Google also have positions with lucrative salaries advertised.
Arm's IPO filing is not without problems in China 8/23/2023
Arm runs most of its China business through an independent unit, called Arm Technology Co., which is its single largest customer and accounted for about 24% of its sales in the year ended March. But Arm and its parent, Japan’s SoftBank Group Corp., don’t control that business.
STMicro offers general purpose microcontroller and a long range radio on the same chip 8/23/2023
Overall, the STM32WL series is the STM32 family’s pioneer in sub-GHz wireless connectivity, offering ease-of-use and reliability, while being perfectly tailored for a wide range of industrial and consumer applications.
EV Adoption Accelerates disregarding pending security problems 8/23/2023
As mass adoption of EVs becomes a reality, it's imperative the industry is cognizant of the accompanying security vulnerabilities.
SK Hynix has turned over its new DRAM chip for AI applications to Nvidia for testing 8/22/2023
HBM3E is the fifth generation of its high bandwidth memory products, which vertically connect multiple DRAM chips to increase the speed of data processing.
HBM Bit Supply Projected to Soar by 105% in 2024 8/22/2023
TrendForce's current production plans from suppliers indicate a remarkable 105% annual increase in HBM bit supply by 2024. However, due to the time required for TSV expansion, which encompasses equipment delivery and testing (nine to 12 months), the majority of HBM capacity is expected to materialize by the second quarter of 2024.
3D printing (3DP) could redefine the factory of the future 8/22/2023
Advancements in printing technologies and materials have helped 3D printing realize its industrial potential, according to a report compiled by Hubs, an online manufacturing platform.
How Data Centers Can Become Greener 8/22/2023
Increasing air inlet temperatures and optimizing power delivery can help contribute to a greener data center.
Samsung to use three stacks of NAND to build its 321-layer 3D NAND devices 8/21/2023
Samsung's 9th Generation V-NAND with over 300-layers is set to hinge on the double-stack technique, which Samsung first embraced in 2020 with its 7th generation 176-layer 3D NAND chips.
Arm to go NASDAQ IPO 8/21/2023
This IPO will split underwriter fees evenly among the four banks leading its initial public offering, according to people familiar with the matter.
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