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| Silicon carbide brings performance, efficiency to EV sector |
5/3/2024 |
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Silicon carbide is being labeled as the next big thing in electric vehicles. SiC offers rapid-charging solutions, power conversion efficiency and overall performance. It also provides versatility and scalability in high-temperature, high-power applications.
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| SK Hynix nearly sold out of HBM chips for 2025 |
5/3/2024 |
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SK Hynix reports booming sales for its high-bandwidth memory chips on AI demand and has nearly sold out its production capacity for next year. The company plans to sample its 12-layer HBM3E this month and begin mass production in the third quarter.
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| NXP sees industrial demand lifting Q2 profit |
5/1/2024 |
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NXP Semiconductors is forecasting its second-quarter profit to beat estimates on industrial demand. NXP's largest revenue share -- automotive -- is beginning to see inventory buildup.
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| 2nm competition is heating up |
4/30/2024 |
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Taiwan Semiconductor Manufacturing Co., Intel and Samsung Electronics are at various stages of production on 2-nanometer processes. TSMC is ramping up production of its N2 this year with N2P planned for 2026; Intel's 18A is set for production in 2025; and Samsung has a foundry contract with a Japanese AI startup for its 2nm process.
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| SK Innovation losses continue for battery unit |
4/30/2024 |
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SK Innovation is slowing its battery investments after its battery unit SK On saw a $241 million operating loss in the first quarter. SK On Chief Financial Officer Kim Kyunghun says electric vehicle launches in North America are expected to drive market improvements.
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| Global PC Market Back in Black in 1Q 2024 |
4/30/2024 |
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Global PC shipments grew by around 3% year-on-year (YoY) in the first quarter (1Q 2024) after eight consecutive quarters of declines due to demand slowdown and inventory correction,
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| Will MicroLEDs Revolutionize Our Screens? |
4/30/2024 |
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As we transition from LCD and OLED screens, microLED stands out as a beacon of innovation, promising unparalleled energy efficiency, luminosity and color depth.
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| TSMC previews A16 process in move toward HPC products |
4/29/2024 |
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Taiwan Semiconductor Manufacturing Co. is detailing the first in its A-series of process technology. The A16, named for angstroms, is seen as a move toward high-performance computing applications and will be available commercially in 2026.
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| TSMC adds N4C process to 4nm portfolio at a lower cost |
4/29/2024 |
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Taiwan Semiconductor Manufacturing Co. is expanding its 4-nanometer class with its N4C fabrication process, which offers fewer masking layers and a smaller die size for up to 8.5% the cost. The N4C builds on TSMC's N4P technology and features the power, performance and area sought by many clients.
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| Qualcomm debuts Snapdragon X Plus for laptops |
4/26/2024 |
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Qualcomm, following last fall's announcement of the Snapdragon X Elite, is adding the Snapdragon X Plus to its next-generation laptop chip line. Both use a 4-nanometer process and Arm-based Oryon CPU architecture and offer 45 TOPS of machine learning performance, but the X Plus is slightly more affordable, with fewer CPU cores (10 vs. 12 in the X Elite) and lower clock speeds (3.4Ghz vs. 3.8Ghz).
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| FTC to ban noncompete agreements |
4/26/2024 |
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The agency said the rule, expected to take effect as soon as late August, received overwhelming public support during a comment period.
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