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TI DLP technology delivers high-precision digital lithography for advanced packaging


Thursday, October 2, 2025

This is the company’s highest resolution direct imaging solution to date and with 8.9 million pixels, sub-micron resolution capabilities and a data rate of 110 gigapixels per second, this device can eliminate the need for expensive mask technology. Despite that it is capable of delivering the scalability, cost-effectiveness and precision that’s required for increasingly complex packaging.

Maskless digital lithography machines - which project light for etching circuit designs on materials without a photomask or high-end stencil - are becoming popular for the manufacturing of advanced packaging, which combines multiple chips and technologies into a single package. This enables high-computing applications, such as data centres and 5G, to have systems that are smaller, faster, and more power-efficient.

Using this DLP technology, system assembly equipment manufacturers will be able to leverage maskless digital lithography to achieve the high-resolution printing at scale necessary for advanced packaging.

The DLP991UUV acts as a programmable photomask, offering precise pixel control with reliable high-speed performance. v“Just as we redefined cinema by enabling the transition from film to digital projection, TI’s DLP technology is once again at the forefront of a major industry shift,” said Jeff Marsh, vice president and general manager of DLP technology at TI. “We're enabling the creation of maskless digital lithography systems that empower engineers around the world to breakthrough the current limits of advanced packaging and bring powerful computing solutions to market.”

By eliminating mask infrastructure and its associated expenses, TI's DLP technology helps significantly reduce manufacturing costs while providing the flexibility to make real-time design adjustments without physical mask changes.

Key features of the device include:

*Highest resolution in the portfolio, offering more than 8.9 Megapixels

*Fastest processing speed of up to 110 Gigapixels per second

*Power levels of 22.5W/cm² at 405nm

*Ability to operate at wavelengths as low as 343nm

*Smallest mirror pitch in the portfolio of 5.4um

By: DocMemory
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