As demand for AI and HPC accelerates, the semiconductor industry is embracing a new era. With Moore’s Law slowing and scaling challenges rising, technologies like 3DIC, fan-out panel level packaging (FOPLP), chiplets, and co-packaged optics (CPO) are becoming essential for next-level performance and system integration.

SEMICON Taiwan 2025 will spotlight these advances through global forums starting September 8, ahead of the main exhibition from September 10–12 at Taipei Nangang Exhibition Center.

Fueled by soaring AI demand, advanced manufacturing capacity is expected to hit a record 1.4 million wafers per month by 2028,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “As AI demands surpass the limits of single-chip scaling, advanced packaging technologies like 3DIC and FOPLP are essential for system-level integration. With the industry moving from a linear supply chain to a more integrated and collaborative ecosystem, SEMICON Taiwan 2025 will serve as a vital global platform for industry leaders to explore how packaging and manufacturing innovation can unlock new commercial value across the semiconductor landscape.”

To drive global collaboration and next-gen system integration, SEMI will launch the 3DIC Advanced Manufacturing Alliance (3DICAMA) at SEMICON Taiwan 2025. The alliance aims to boost cross-industry collaboration, enhance supply chain resilience, promote standards adoption, and speed technology commercialization.

SEMICON Taiwan 2025 will host the Heterogeneous Integration Global Summit (HIGS), FOPLP Innovation Forum, and 3DIC Global Summit, covering topics from design and materials to process and supply chain. Industry leaders, including ASE, Broadcom, Lightmatter, MediaTek, Nvidia, Sony, and TSMC, will join HIGS Series to address challenges in 3DIC, CPO, and AI packaging. At the FOPLP Innovation Forum, AMD and PTI will share the latest innovations and market strategies.

year’s Heterogeneous Integration Area will expand to three pavilions: 3DIC Advanced Packaging, FOPLP, and Semiconductor Packaging. Leading companies such as Innolux, PTI, Comet, Coherent, E&R Engineering, GP, Lam Research, Manz, Mirle, PDF Solutions, PSK, Shibaura, and Utechzone will showcase advanced integration applications and foster partnerships.

By: DocMemory
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