AMD and Intel are both actively pushing their products in the embedded market, with AMD increasing the number of processors available for industrial PC (IPC) makers while Intel plans for its server platform to hit the telecommunications market in the later half of 2007 and its mobile platform to hit the low-power embedded market, according to sources familiar with plans from AMD and Intel.

Among the processors that AMD currently plans to offer under its embedded lineup include its Operon server series processors, Athlon 64 X2 and Athlon 64 series desktop processors, and Turion 64 X2, Turion 64 and Sempron mobile processors. AMD's inclusion of these processors under its embedded lineup will give IPC makers more choices to chose from that just the Geode series, according to Taiwan-based IPC makers.

Intel, is focusing its embedded product lineup on the telecommunication server and blade server market, according to the sources. According to Intel's current plans, high-end servers will still use the Bensley platform, while dual processor (DP) blade servers will be switching to the DP Cranberry Lake platform in the later half of 2007, added the sources.

UP (Uni-processor) blade servers, in which Intel used Core 2 Duo and Core Duo mobile series processors, will start to use the UP Cranberry Lake platform, while Core 2 Duo and Core Duo mobile series will go into the low-power embedded market in the later half of 2007, added the sources.

Intel also plans to launch its Arbuckle Mountain platform, which uses the Core 2 Duo mobile series processor and E7250 northbridge chipsets, said the sources. The main purpose for the platform is to assist IPC makers to develop IPC motherboards that support Core 2 Duo or Core Duo mobile series processors, the sources pointed out.

By: DocMemory
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