Boise, Idaho-based memory giant Micron Technology Inc. opened a new manufacturing facility in Xi’an, China this week, the company’s first such facility in the country, designed to assemble and test Micron’s semiconductor products, including dynamic random access memory, NAND flash memory and CMOS image sensors.

Micron expects the facility to be built-out by the end of 2008 at an investment of $250 million and will support up to 2,000 employees.

This is Micron’s second assembly and test facility in Asia; the first opened in Singapore in 1998.

Also, Micron says this new Xi’an facility will be one of the largest investments of the 860 foreign-invested companies operating in the Xi’an High Tech Zone in Shaanxi Province in Midwest China.

Steve Appleton, chairman, CEO and president of Micron said in a statement, “By opening this facility in Xi’an, we are enabling customers and partners to design applications with service, support and quality from Micron, and we are pleased to be a growing part of the China technology industry.”

While the Xi’an facility is Micron’s first manufacturing plant in China, the company says is no stranger to the China business community. Micron first came to China in 2001 to service its growing customer base from an office in Xiamen.

Then in 2004, Micron established Micron Semiconductor Shanghai in Shanghai with about 60 employees and branch offices in Beijing and Shenzhen to provide corporate, sales and marketing services throughout China.

Also in 2004, Micron also chose Shanghai as the location of one of the company’s integrated circuit design centers and formed Micron Semiconductor Technology. With about 50 employees, Micron Semiconductor Technology is a key hub in Micron’s network for providing support to a variety of Asia-based mobile phone and consumer electronic device manufacturers.

Earlier this week, Micron helped launch a new lab at the University of Washington to research new combinations of materials for use in semiconductor manufacturing.

By: DocMemory
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