Lin Packaging Technologies filed suit against Infineon and Nanya Technology for infringing on two patents involving packaging of DDR2 memory modules.

The suit, filed in U.S. District Court for the Eastern District of Texas, focuses on technology used in multiple chip modules. Lin, based in Marshall, Texas, is seeking damages and punitive damages.

The patents in question are “substrate on chip multiple chip module with chip-size package ready configuration,” which was awarded in 2001, and “multiple chip module configuration to simplify testing process and re-use of known-good chip-size package,” issued in 1999. Both Nanya, based in Taiwan, and Infineon, based in Germany, have U.S.-based subsidiaries that Lin claims have infringed on its patents.

By: DocMemory
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