Pure-play flash memory solutions provider Spansion Inc. and DRAM manufacturer and recent Infineon spin-off Qimonda AG today announced that the companies have signed a strategic supply agreement that will combine Qimonda's low-power specialty DRAM with Spansion's MirrorBit NOR and ORNAND devices into multi-chip packages (MCP) memory solutions for mobile devices.  

Under the terms of the agreement, Qimonda will provide Spansion with its low-power pseudo SRAM (PSRAM), or CellularRAMs as Qimonda calls them, and mobile-RAM devices in known good die (KGD) form, which Spansion will use in MCP solutions. The term KGD means that Qimonda claims to perform all functional and quality testing of the dies on the finished wafer, which are then stacked with Spansion flash memory in a compact MCP.

MCP solutions with 64Mb and 128Mb CellularRAM are already available from Spansion and are shipping in mass production.  Products featuring higher storage densities and products based on double data rate (DDR) mobile-RAM are planned for later in 2007.

By: DocMemory
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