Akita Elpida Memory, the DRAM backend production subsidiary of Elpida Memory, announced the development of a 1.4mm-thick multi-chip package (MCP) with 20 stacked dies, claiming it as the world's thinnest MCP.

As portable devices shrink, demand for smaller memory package grows. Akita Elpida Memory noted that demand for five- and seven-die stacking continues to rise.

The memory packaging house explained that the packaging was accomplished by using technologies to grind, handle and attach 30-micron-thick chips as well as 40-micron low loop wire bonding, overhang wire bonding and resin injection technology.

By: DocMemory
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