Powerchip Semiconductor Corporation on June 21 held a ground breaking ceremony for its IC research and testing center in Hsinchu, Taiwan. The memory maker has budgeted NT$2.5 billion (US$76 million) for the first phase of the center.

The center will have a wafer testing facility to support future backend production demand from PSC, the company noted. PSC anticipates that related capacity will be ready in the second quarter in 2008. After the first phase of construction is completed, the office building could house as many as 500 engineers.

Citing company executives, a Chinese-language Economic Daily News (EDN) report stated that the center will house a testing capacity of 400,000 12-inch wafers per month. The executives were cited as saying that PSC will share this amount of capacity with its subsidiary, Rexchip Electronics, a joint venture (JV) with Elpida Memory.

By: DocMemory
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