TI(Texas Instruments) and Ericsson AB have released their co-development of custom 3G handsets, which will promote TI's OMAP processor line , Ericsson's 3G RF and modem technology.

The collaboration builds upon a 20-year relationship between the two companies and is intended to speed the development of next-generation handsets with an emphasis on an open OS model. The close collaboration should also see overall system improvements in terms of power management, integration, component counts, board size and security.

Along with OS support, the quality and stability of the modem's protocol stack is critical for a handset. That, along with proven RF technology, is what Ericsson brings to the deal, according to Robert Puskaric, head of Ericsson Mobile Platforms. To date, he said Ericsson's RF and modem technology is in over 40 million WCDMA phones, worldwide.

The companies expect to see the first handset resulting from the deal to emerge in the second half of 2008. It will be based on the High Speed Packet Access (HSPA) air interface with downlink rates of 7.2 Mbits/s and uplink rates of 2.9 Mbits/s.

By: DocMemory
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