SanDisk and Hynix plan to build a joint fab for NAND flash, according to a report quote an article from Wall Street Journal as source.

Quoting SanDisk CEO Eli Harari, WSJ writes that the companies plan to invest jointly in the construction of a 300mm wafer fab for NAND flash products. Though Harari did not provide any further details, WSJ estimates an investment sum of about $2 billion.

German web site Heise.de which also reported on the topic, wrote that the new fab will be built in Switzerland. The site did not specify its source.

Recently, demand and prices for NAND flash hiked, triggered not least by a power failure at top NAND manufacturer Samsung that caused six production lines to stop. While the problem has been resolved in the meantime, market watchers see rising prices for this type of non-volatile memory chips.

By: DocMemory
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