In a new development that has the potential to allow for consumer electronics of an unprecedented size, memory chip maker Hynix Semiconductor has reportedly developed a 1.4-millimeter thick multi-chip package (MCP) with 24 stacked NAND flash memory chips.

According to reports from Korean newspaper Korea Times, Hynix's new technology enables 384-gigabits, or 48-gigabytes, of memory to be contained in one device comprised of 24 stacks of 16-gigabit NAND flash chips.  The MCP purportedly has enough capacity for about 25 DVD movies, or about 12,000 music files.

An unnamed Hynix official reportedly told the newspaper that the company hopes to develop an MCP with 28 stacked NAND chips in the coming years. An official launch date for the 24-chip MCP has not been disclosed.

Hynix could not be reached by Electronic News for comment on the news.

Hynix is not the only chip company working to make ambitious leaps ahead in memory concentration. In November, top-ranked memory maker Samsung Electronics Co. Ltd. announced it had developed a process to allow production of a 16-chip MCP, which would contain 16-gigabytes of memory in one package.

By: DocMemory
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