Monday, September 24, 2007
Virtium Technology Inc. announced a family of small form-factor Very Low Profile VLP DDR3 Registered ECC SO-DIMM, VLP DDR3 ECC SO-DIMM, VLP DDR3 SO-RDIMM and VLP DDR3 SO-CDIMM ECC memory for embedded systems.
The VLP DDR3 ECC SO-DIMMs are designed for space constrained next-generation AdvancedTCA, AdvancedMC, MicroTCA, PicoTCA, PC104, SBB canisters and PICMG SBCs.
Virtium VLP DDR3 SO-DIMM ECC memory modules are designed with enhancements to the JEDEC standard, including ECC SO-DIMM error correction, registered ECC SO-DIMM functionality for the VLP SO-RDIMM and reduced module height of 0.72 inches, enhanced from the JEDEC standard of 1.18 inches.
All Virtium DDR3 ECC SO-DIMM memory modules are available with optional SO-DIMM heat-spreader, industrial temperature extended temperature range DRAM, or thermal sensors to improve thermal performance in demanding environments or for small compact chassis with limited internal space and minimal airflow
By: DocMemory
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