Thursday, September 27, 2007
SanDisk has opened a system-in-package (SIP) assembly and test facility in Shanghai, the company's first in the People's Republic of China.
Based in the Zizhu Industrial-based Science Park, SanDisk Semiconductor (Shanghai) Co. Ltd. (SDSS) is expected to play a critical role in SanDisk's operations as the plant is set to focus on the assembly and test of flash memory products.
The plant produces system-in-package components that incorporate flash memory die and other chips.
The new 34,000 square meter facility is a vertically integrated production operation with all test and assembly processes carried out at the plantfrom receiving wafers from the company's fabrication sources, or fabs, based in Japan to shipping complete products to customers. The production capacity of SDSS is expected to meet approximately 30 percent of SanDisk's projected global demand for SIP products.
By: DocMemory Copyright © 2023 CST, Inc. All Rights Reserved
|