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Rexchip opens first 300mm Fab


Thursday, October 18, 2007 Elpida Memory and Powerchip Semiconductor joint venture company, Rexchip Electronics Corp., has recently opened its first 300mm fab at the Central Taiwan Science Park Houli Site.

Frank Huang, PSC chairman and concurrent Rexchip chairman, stated that in less than one year since groundbreaking, the JV company was able to begin operations.

Meanwhile, Yukio Sakamoto, Elpida president and CEO, said that despite the severe volatility associated with the DRAM market, Rexchip will be able to continuously expand in Taiwan as it has the most advanced 70nm process technology, creating what could be the largest and lowest-cost 300mm DRAM fabrication base.

Last December, Powerchip and Elpida announced the agreement to establish joint venture Rexchip Electronics and expecting the investment in Taiwan of $13.7 billion in order to establish the largest 300mm DRAM fabrication base in the world. After 10 months, Rexchip's first 300mm fab (Fab R1) and administration building have already been completed, with an installed capacity of 30,000 manufacturing completely on 70nm process technology.

In Q4, volume production of 1Gbit DDR2 DRAM will be shipped to PSC and Elpida effectively contributing to both parent companies' revenue.

Rexchip, with over 1,800 employees, has already invested more than $1.8 billion in the Central Taiwan Science Park Houli Site. In addition, Rexchip's investment for the construction of four 300mm fabrication facilities, creating more than 5,000 jobs, will make the Central Taiwan Science Park Houli Site one of the world's largest and strategically important DRAM base

By: DocMemory
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