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Elpida Memory Inc. will start producing DRAM chips using only advanced 300mm silicon wafers in March 2008 to lower per-chip costs in a race against tumbling price falls.

Elpida said it would make the shift to 300-mm wafers, which yield twice as many chips per wafer as 200-mm ones, at some point in 2008.Memory makers are beefing up capital spending to hold on to margins amid sliding prices, fueling further price declines.

Elpida spokesman Hideki Saito said on Thursday (Oct. 18) the company has set a specific target of March for the shift.