SMART Modular Technologies has added to its lineup of Socket F, DDR2 registered DIMMs with an 8-Gbyte module.

The RDIMM module incorporates SMART's dual die packaging (DDP) technology and provides cost advantages by leveraging mainstream 1-Gbit DDR2-667 and DDR2-800 technology.

Uses include high-performance computing (HPC) applications and large data center deployments. The registered DIMMs (RDIMMs) can be used in systems equipped with advanced ECC, such as Chipkill technology by IBM Corp. In addition, SMART's 8-Gbyte RDIMMs are fully compatible with four-rank enabled Socket F systems.

The DDP-based 8-Gbyte DDR2-667 RDIMM looks and performs like a standard dual-row four-rank module; however, SMART's DDP technology actually doubles the density. As a result of the identical footprint, the DDP-based RDIMM offers OEMs a transparent upgrade path from standard modules. The 8-Gbyte DDR2-667 RDIMM is configured as 1024Mx72 with four-ranks using 2-Gbit (512Mx4) DDP components.

SMART's 8-Gbyte DDR2 RDIMM offers OEMs the lowest cost options to upgrade their systems with more memory. The 8-Gbyte DDR2-667 version enables OEMs to populate 4-way, 8-socket, dual-rank and quad-rank enabled systems with up to 256-Gbytes of memory per node running at a 667-MHz data rate.