Qimonda has revamped its 200-mm manufacturing strategy and plans to end 200-mm production with two foundry partners: Semiconductor Manufacturing International Corp. (SMIC) and Winbond Electronics Co

Qimonda will discontinue its contract manufacturing deal for 200-mm wafers from its former parent, Infineon Technologies AG.

The move follows losses and a major DRAM downturn. Overall, Qimonda plans to focus its production on 300-mm capacities, reducing its 200-mm manufacturing worldwide. With this move, the share of 300-mm capacity will increase to approximately 90 percent by the end of the current financial year.

With its fabs in Richmond, Virgina, the number of 200-mm wafer starts will be reduced by approximately 15 percent, ''in the context of switching capacities from 110-nm to 80-nm technology, according to the company. ''The remaining 200-mm capacity will continued to be used for manufacturing legacy products.''

At its Dresden site in Germany, Qimonda will discontinue the contract manufacturing of 200-mm products by Infineon Dresden. The last wafers for Qimonda will enter production at the end of February 2008.

Qimonda's activities in Dresden will be its 300-mm manufacturing and R&D. Infineon in Dresden will focus on logic for various applications such as automotive, communications or security, positioning the site as a competence center for chips sizes from 250- to 90-nm.

By: DocMemory
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