Friday, December 21, 2007
Infineon Technologies AG said it has agreed to license embedded flash memory manufacturing process to IBM. The 130-nm version of the process will be deployed by IBM for manufacturing in North America and Infineon said it would use IBM foundry services for its future products based on this process.
The Infineon 130-nm embedded flash process, which has been in volume production at Infineon plants since early 2006, is used for microcontroller chips in applications ranging from automotive systems to smartcards.
"We are pleased to extend our long history of collaboration and technical development with IBM through this licensing and foundry agreement," said Peter Bauer, head of the automotive, industrial and multimarket business group at Infineon. "With this collaboration, Infineon leverages the value of its own manufacturing IP, gains a new source for volume manufacturing, and strengthens our working relationship with a long-term partner."
"We are broadening our semiconductor-offering portfolio by collaborating with Infineon, one of the world leaders of embedded flash technology," said Steve Longoria, vice president for semiconductors at IBM Global Engineering Solutions. "This licensing agreement leverages our current technology base and complements our analog and mixed signal expertise."
Integration and qualification of the process has begun at IBM's 200-mm wafer fab in Burlington, Vermont, and preliminary design kit availability is planned for the second half of 2008.
By: DocMemory
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