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Elpida and UMC to build Fab in Japan


Tuesday, March 18, 2008

Elpida Memory and United Microelectronics Corporation (UMC) announced an agreement to jointly pursue semiconductor foundry opportunities in Japan. Under this agreement, Elpida will provide its 12-inch wafer manufacturing capacity while UMC will contribute the intellectual property (IP) support and logic technologies to serve Japan-based foundry customers.

The alliance announced today extends the joint development program that the two companies announced in October 2007 for copper/low-k, DRAM, and phase-change random access memory (PRAM) technologies. Thus far, the collaboration is progressing well, which led the two companies to decide to seek out further possibilities for joint development, as well as for cooperation in manufacturing, UMC said.

By: DocMemory
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