Qimonda and Elpida Memory have announced the signing of a memorandum of understanding (MOU) for a technology partnership to jointly develop DRAM.

In the planned partnership, Qimonda will provide its know-how with Buried Wordline technology and Elpida its stack capacitor technology. The strategic technology cooperation is expected to leverage the strength of both companies to accelerate their roadmap to DRAM products featuring cell sizes of 4F2. The companies plan to introduce the jointly developed 4F2 cell concept within the 40nm generation in 2010 and to subsequently scale it to the 30nm generation.

The companies plan to jointly develop technology platforms and design rules to enable both exchange of products and potential manufacturing joint ventures. Both companies target to align development activities at their respective sites in Hiroshima, Japan and Dresden, Germany, including the exchange of engineers. Additionally, the companies have also agreed to explore joint development opportunities in the areas of Through Silicon Via Technology and future memories.

By: DocMemory
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