Intel, Samsung and TSMC have reached an agreement on the need for industry collaboration for 450-mm wafers starting in 2012.

Intel, Samsung and TSMC indicate that the semiconductor industry can improve its return on investment and reduce 450-mm research and development costs by applying aligned standards, rationalizing changes from 300-mm infrastructure and automation, and working toward a common timeline.

The three companies will continue to work with International Sematech (ISMI), which is coordinating industry efforts on 450-mm wafer supply, standards and developing equipment test bed capabilities.