Wednesday, May 21, 2008
Intel has reopened its chip assembly and test facility in Chengdu, China, a site 55 miles from the epicenter of the massive earthquake that rattled Sichuan province last week.
"We are ramping it up as fast as we can," Intel spokesman said, without giving an estimate on when the facility would return to full capacity.
Intel started powering up the plant and checking its machinery on Friday and output resumed Sunday.
The plant suffered cosmetic damage in last week's quake, but revealed no structural damage.
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