Targeting the manufacture of future-generation semiconductor packages, Neubiberg, Germany-based Infineon Technologies AG, Singapore-based semiconductor packaging design, assembly, test and distribution provider STATS ChipPAC Ltd and Geneva-based semiconductor giant STMicroelectronics said today that they have agreed to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon’s first-generation technology.

Semiconductor giants ST and Infineon have joined forces with 3D packaging provider STATS ChipPAC to leverage the potential of Infineon’s existing eWLB packaging technology, which has been licensed by Infineon to ST and STATS ChipPAC. The R&D effort will focus on using both sides of a reconstituted wafer to manufacture semiconductor devices with a higher integration level and a greater number of contact elements. The resulting IP will be owned by the three companies.

Infineon explained that the eWLB technology uses a combination of traditional ‘front-end’ and ‘back-end’ semiconductor manufacturing techniques with parallel processing of all the chips on the wafer, meant to lead to reduced manufacturing costs. With the increased level of integration of the silicon’s overall protective package, along with a dramatically higher number of external contacts, the technology is meant to allow significant cost and size benefits for wireless and consumer product makers.

ST said its decision to work with Infineon to jointly develop and use this innovative technology, with the integration of package size, marks an important milestone for eWLB on its way to becoming an industry standard for cost-efficient and highly integrated wafer-level packages.

Further, ST said it plans to use the technology in several products of its ST-NXP wireless joint venture and in other application markets, with first samples expected by the end of this year and production by early 2010.

Infineon reminded that it introduced the eWLB packaging technology in fall 2007, and the company believes it sets the benchmark in integration level and efficiency and paves the way to providing the industry and end consumers with a new generation of energy-efficient, high performing mobile devices.

These new packaging processes of WLB technology allow the benefits to be extended, namely: cost-optimized production and enhanced performance features. With eWLB, all operations are performed at wafer level, as with WLBs, signifying concurrent processing of all the chips on the wafer in one step. As well, the package technology is meant to allow a 30% reduction of dimension compared to conventional lead-frame laminate packages and an almost infinite number of contact elements, the companies explained.

“The eWLB technology is an excellent complement for our next-generation leading edge products, especially in wireless applications. The eWLB technology sets new milestones in innovation, cost competitiveness and dimensions and we believe that, together with Infineon, we will pave the way to a new powerful package technology platform,” concluded Carlo Cognetti, director of advanced packaging technology at STMicroelectronics, in a statement.

By: DocMemory
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