Friday, October 24, 2008
Semiconductor Manufacturing International Corporation (SMIC) has announced that it has successfully developed a 0.11-micron CMOS image sensor (CIS) process technology.
With this new production process, SMIC-manufactured CIS devices exhibit improved resolution, low noise, and enhanced image contrast for high performance CMOS image applications, the foundry stated.
SMIC offers complete CIS foundry service in China, and its CIS 0.11-microns capability gives customers a leading edge solution at competitive costs while complementing its existing 0.18-micron and 0.15-micron CIS technologies.
The 0.11-micron CIS technology will be available with both aluminum and copper backend metalization and targets applications including cameraphone, computer camera, and industrial and security monitoring. SMIC has begun pilot production for customers, with manufacturing available on on 200mm and 300mm wafers.
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