Intel reveals Next Generation Mobile and Storage Technology

During the Intel Developer Forum (IDF) Taiwan at the Taipei International Convention Center, Intel revealed its concept for the next generation mobile computing platform and the new generation storage device. Combining current market needs, innovative technology applications, and environmental friendly concepts, Intel introduced Calpella – Nehalem based mobile computing platform – and UrbanMax – a new mobile computing concept in addition to a high performance SSD as the theme to this year’s IDF.

In 2009, Intel expects to launch the Nehalem based Calpella platform featuring better system integration and more innovative power saving schemes such as Integrated Power Gate Technology for memory system, cache, and IO system which boosts energy efficiency by dynamically shuts off subsystems not in use according to users’ habit. UrbanMax, on the other hand, is a design based on Small Form Factor (SFF) technology to target Web 2.0 users. UrbanMax platform consists of a new SFF Intel processor, High Performance SSD, HD Playback and an 11.1”touch screen.

Intel continued to sketch out its future concept of what an MID should be by continuously creating potential applications for MID. Applications such as community network, user-created web content, and location-based service will help proliferate the use of MID as the trend to use mobile internet takes off.

At IDF, Intel also introduced its own SSD solution and demonstrated Intel’s solution on SSD-related issues such as reliability, life cycle, and software/hardware integration. Comparing Intel’s X25-E Extreme SATA SSD with other current SSD offerings in the market, Intel’s solution features capacity of either 32 or 64GB and SATA1.5/3.0 interface with read/write speed up to 250MB/s and 170MB/s respectively. Combined with a high degree of integration with VISTA, Intel’s SSD solution has excellent potential in common notebook and data storage market.

By: DocMemory
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