Wednesday, November 5, 2008
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) appears to have taken a slight lead in the high-voltage foundry market.
The silicon foundry giant has enhanced its 0.13-micron process with the availability of a 1.5-, 6- and 32-V technology.
In comparison, TSMC's rivals are rolling out their respective 0.18-micron processes. Dongbu, IBM, Tower/Jazz, X-Fab and others have made various claims in the arena.
Targeted at display drivers, TSMC's process features an aluminum copper backend metal scheme. The new technology claims to cut die size requirements for new high-resolution mobile handset display drivers.
It also adds the necessary core voltage under-drive range, at 1.2-V, to meet the most stringent green panel requirements, according to TSMC (Hsinchu, Taiwan).
Industry pundits proclaimed 2008 the year of analog. With the growth of the analog chip market far outpacing that of digital, a slew of foundry vendors jumped into the arena. Most are offering a high-voltage process.
By: DocMemory
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