Tuesday, January 20, 2009
Semiconductor equipment vendor Aixtron AG (Aachen, Germany) and Ovonyx Inc. (Rochester Hills, Mich.) have agreed to cooperate on the qualification of atomic vapor deposition (AVD) process technology for the scaling of phase change memory (PCM) products.
"Aixtron's leading market position in thin-film deposition equipment for the semiconductor industry provides an excellent platform for competitive development of new phase change material by AVD technique for next-generation, high-density confined cell PCM device structures," said Tyler Lowrey, president and CEO of Ovonyx, in a statetment.
"PCM is on the verge of commercial adoption using conventional sputter physical vapor deposition techniques, however, it is clear that subsequent generation PCM cells would significantly benefit from atomic vapor deposition of phase change materials to further increase scalability and accelerate cost reductions," said Bernd Schulte, chief operating officer of Aixtron, in the same statement.
By: DocMemory
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