Home
News
Products
Corporate
Contact
 
Thursday, January 23, 2025

News
Industry News
Publications
CST News
Help/Support
Software
Tester FAQs
Industry News

Rambus unveils new Memory Interface for Mobile Device


Monday, February 2, 2009 Rambus Inc. will demonstrate at DesignCon a new memory interface geared for mobile devices that delivers 16 times the bandwidth of today's technologies at a fraction of the power they would consume. 

The new interface combines signaling and low power technology Rambus described in a February 2007 paper with clocking techniques used in its existing XDR interface. The result is an interconnect that can deliver as much as 4.3 Gbits/s per link using as little as a quarter of the power today's interfaces would require.

The approach employs a very low swing differential signaling technique that uses signals close to ground with a 100 millivolt swing, about a tenth the swing of today's interfaces. Rambus first disclosed the technique in the 2007 paper, describing a 6 Gbit/second serdes transceiver that consumed just 2.2 milliwatts per gigabit per second in a 90-nanometer process.

The approach uses a slightly modified version of the FlexClocking technique used on the Rambus XDR interface, implemented on the Sony Playstation3. Like XDR, the mobile interface drives most of its complexity to the controller, keeping the DRAM design relatively simple.

Rambus will show at DesignCon two 40nm test chips mounted in a package-on-package arrangement with one acting as a receiver and the other as a transmitter. The device will deliver 4.3 Gbits/s at 3 milliwatts per Gbit/s.

By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2023 CST, Inc. All Rights Reserved