Thursday, March 19, 2009
Samsung Electronics has announced that shipments of the world's first and smallest high-density memory modules based on 2Gb, 50nm-class DDR3 have kicked off.
Samsung is shipping its DDR3-based modules, which include a 16GB registered inline memory module (RIMM) and an 8GB registered dual inline memory module (RDIMM), for server applications.
The Samsung 16GB DDR3 module operates at 1066Mbps, which allows 192GB of total memory density for a 2-socket CPU server system. Samsung also claims to be the first to offer 16GB RDIMMs operating at 1.35 volts, providing around 20 percent savings in power consumption over 1.5V DDR3 solutions.
Samsung's 16GB RDIMM also features a dual-die package configuration, which is more efficient in cost and performance over the widely discussed quad-die configuration, according to the company.
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