Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that the patent at issue is due to expire next year.

In January 2006, Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), ChipMOS Technologies and STATS ChipPAC received notice of a patent infringement lawsuit brought by Tessera, which accused them of infringing several Tessera patents regarding DDR2 comprising fine-pitch ball grid array (BGA) packaging. However, no final ruling had been made, prior to the lawsuit's withdrawal.

Tessera on March 12 announced that it decided to terminate the US International Trade Commission (ITC) action brought against certain semiconductor packaging subcontractors, Investigation No. 337-TA-649 (Subcon ITC action). The US vendor said the termination does not afect other pending actions including ITC Investigation No. 337-TA-605 (Wireless ITC action) and ITC Investigation No. 337-TA-630 (DRAM ITC action).

"Tessera is focusing its resources on vigorously pursuing swift and favorable enforcement of its patent rights in the DRAM ITC action and the Wireless ITC action," said Bernard J Cassidy, Tessera's general counsel.

Citing uncertainties created by legal rulings relating to ITC remedies available against non-importers, related delays in the progress of the lawsuit action, Tessera has decided to focus its ongoing enforcement efforts as the reasons for the move to terminate.

By: DocMemory
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