Winbond Electronics said DRAM production at its 65nm process node is progressing with yield rates on the rise. Annual production capacity is expected to reach 8,000 wafers at the end of 2009.

As for NOR flash, Winbond is scheduled to ramp up production on 90nm in the second quarter of 2009, according to the company. Monthly output of 90nm NOR products is expected to total 3,000-4,000 wafers.

Winbond has estimated that standard DRAM will account for 44% of its total memory output for 2009, followed by specialty DRAM with 30%, NOR flash with 15% and mobile RAM with 11%. The company said its future focus will continue to be placed on the development of niche product lines.

Winbond has expressed caution about the strength and sustainability of the economic recovery, but optimism over an improvement in demand driven by increased domestic spending in China.

Winbond announced revenues for May 2009 of NT$1.37 billion (US$41.7 million), down 4.31% from April. Accumulated sales from January through May totaled NT$5.93 billion, representing a decrease of 45.5% from NT$10.87 billion a year earlier.

By: DocMemory
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