ProMOS Technologies will sign a DRAM supply agreement with Elpida Memory soon, forming a partnership that may be key to success of the Taiwan government-led Taiwan Memory Company (TMC) project, according to industry sources.

ProMOS will initially supply Elpida, the technology partner elected by TMC, with 65nm-made DRAM at its 12-inch fab at the Central Taiwan Science Park (CTSP), the sources said.

ProMOS's 12-inch fab at CTSP, which has a monthly capacity of 60,000 wafers, will also serve as TMC's R&D center, with personnel and equipment support from ProMOS, the sources said.

According to previous reports, TMC plans to base its headquarters at CTSP, where it intends to utilize existing 12-inch DRAM fabs. In addition to ProMOS, Rexchip Electronics and Winbond Electronics also run 12-inch fabs in the science park.

ProMOS still maintains its existing partnership with Hynix Semiconductor, despite its pending collaboration with Elpida, the sources indicated. ProMOS, which last year signed a new agreement to extend its partnership with Hynix for 50nm-class DRAM stack process, has had difficulty in upgrading its equipment due to a lack of funding.

By: DocMemory
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