UMC noted growing customer demand for leading edge capacity and expansion of the company's market share for advanced process technologies as its reasons behind the migration.

"It will also create more local job opportunities for Singapore while attracting more talented engineers to UMC from all over the world," Po Wen Yen, senior VP in charge of 300-mm operations at UMC, said in a statement. "Furthermore, it will contribute greatly to Singapore semiconductor industry's development and create benefits for customers, the local community and UMC."

UMC did not offer financial details for the manufacturing expansion, nor did it offer a timeline for its plans.

Construction for UMC's 12i was completed in April 2002 as Singapore's first 300-mm fab. Pilot production at the plant began in 2003. Fab 12i has a current capacity of 31,000 wafers per month and currently is in volume production for customer products down to 65/55 nm.

By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved