Taiwan Semiconductor Manufacturing Company (TSMC) is expected to invest up to US$6 billion in the fifth- and fourth-phase capacity expansion at its 12-inch Fab 12 and Fab 14, respectively, with equipment installation slated to kick off in the second half of 2010.

TSMC plans to begin installing new equipment at Fab 12, located at the Hsinchu Science Park (HSP), in October 2010, the sources indicated. The foundry is expected to move in equipment for the expansion at Fab 14 in southern Taiwan at the end of the year.

TSMC is expected to ramp total 12-inch capacity to 70,000 wafers (35,000 each at Fab 12 and Fab 14) monthly in 2010, according to the sources.

TSMC revealed in its latest quarterly financial report that total managed capacity in 2009 would grow 6% on year to 9.937 million 8-inch equivalent wafers, while capacity for 12-inch wafer fabs is likely to increase by 10%. In 2008, its managed capacity totaled 9.377 million 8-inch equivalent wafers, representing an increase of 13% from 8.29 million units in 2007. Capacity for 12-inch wafer fabs increased by 27%.

TSMC, which had earlier slowed down expansion of its 12-inch capacity amid an industry downturn, began accelerating the expansion in the second quarter of 2009, according to previous reports.

TSMC's upcoming investors conference will be held tomorrow (October 29).

Fabs 12 and Fab 14 are TSMC's 12-inch fabs processing silicon on advanced 45nm and beyond processes.

TSMC recently issued company filings with the Taiwan Stock Exchange (TSE) announcing seven purchases of machinery equipment between October 6 and 27, with a total transaction value of about NT$6.29 billion (US$193 million). Its equipment purchases during the third quarter totaled NT$54 billion.

By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved