Tuesday, November 17, 2009
With customers pushing the DDR3 generation, memory packaging and testing firms Powertech Technology (PTI), Formosa Advanced Technologies Company (FATC) and Walton Advanced Engineering all estimate DDR3 will contribute 90% to their overall DRAM shipments at the end of 2010, up from 40-50% at end-2009, according to company sources.
PTI chairman DK Tsai said at the company's recent investors conference that capex for 2010 is likely to reach NT$10 billion (US$310.7 million), compared to NT$7 billion allocated for 2009. PTI will step up investment in high-speed testers for DDR3 chips and expand NAND flash chip capacity.
FATC recently said its capex for 2010 will double from this year's NT$2 billion. Spending for 2010 will mainly focus on purchases of high-speed testers, and capacity expansion for memory packaging and LED chips .
As the major backend supplier for Nanya Technology, FATC began to install new high-speed testers for DDR3 chips in September, according to market watchers.
Walton's capex for 2010 is estimated at NT$3 billion, compared to around NT$2 billion for 2009, according to the company in previous reports. Walton said it
will add 10 more sets of high-speed testers, which do not include 5593 ones, for a total of 17 sets by the end of 2010.
DDR3 is forecast to account for 90% of Walton's overall DRAM revenues at the end of 2010, up from 20-30% at present, the company said in reports.
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