Elpida Memory and  ProMOS Technologies will hold a joint press conference this week to reveal details about their DDR3 foundry partnership.

Elpida is expected to spell out its outsourcing approach, seen as a move to compete against its Korean rivals. The Japan-based memory chipmaker has tied up with ProMOS and Winbond Electronics, with the former agreeing to produce its DDR3 chips and the latter to make graphics DRAM.

Sources estimated that ProMOS allocated chip capacity based on Elpida designs will be 35,000 wafers per month. ProMOS was quoted in previous reports as saying it is scheduled to start mass production of Elpida 1Gb DDR3 chips on 65nm in the second half of 2010.

Mean while, Elpida has gained a majority stake in joint venture Rexchip Electronics, which now supplies a monthly capacity of 80,000 12-inch equivalent wafers to Elpida, according to previous reports.

By: DocMemory
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