ProMOS Technologies is in negotiation with four potential investors, and expects to draw new funds by May or June 2010 to help smoothly ramp its chip production based on Elpida Memory's design.

ProMOS is moving to convert its production capacity to Elpida's extra-shrink 65nm process from Hynix Semiconductor's 70nm node, and will then follow the Japan partner's move to a 4F2 cell design and next-generation 40nm.

ProMOS has said it will use its 300mm (12-inch) wafer fab located at the Central Taiwan Science Park (CTSP), which currently has a monthly capacity of 60,000 wafers, to make chips based on Elpida's designs.

ProMOS plans to sell or exchange its old or unused equipment for new ones, according to Chen, adding that migrating from Hynix's 70nm stack to Elpida's 65nm stack will only need limited equipment replacement. Elpida will also support ProMOS's equipment upgrades via Rexchip Electronics, Chen said.

ProMOS is scheduled to kick off trial runs on 65nm for Elpida's DDR3 chips in the first half of 2010, and start mass production in the second half.

By: DocMemory
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