Wednesday, December 30, 2009
ProMOS Technologies has issued a filing with the Taiwan Stock Exchange (TSE) dismissing rumors of pending layoffs, saying it currently has no plans to cut jobs.
Rumors have spread that ProMOS' plans to sell its 300mm (12-inch) wafer fab at the Hsinchu Science Park (HSP) will impact 2,000-3,000 staff, 5-8%, of its total workforce.
ProMOS chairman ML Chen was quoted in previous reports saying the company expects to wrap up a deal to sell its 12-inch facilities at HSP before the Lunar New Year. Macronix International Company (MXIC) is speculated to be the buyer.
ProMOS laid off about 550 staff in June to cope with the economic downturn, according to previous reports
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