United Microelectronics Corporation (UM) has recently announced plans to add a total of 1,000 engineers for its Fab 12A, a 12-inch wafer fab located at the Southern Taiwan Science Park (STSP).

The STSP administration said earlier this week that UMC will start phase-three equipment installation at its STSP facilities in 2010. The park administration also revealed that Taiwan Semiconductor Company (TSMC) is set to complete phase-four equipment installation at its Fab 14 at STSP by the end of this year.

UMC is looking to boost 45/40nm process capacity at Fab 12A, according to previous reports. The foundry chipmaker is also gearing up to ramp 45/40nm production at Fab 12i, another 12-inch facility located in Singapore.

UMC's Fab 12A and Fab 12Ai reached a combined capacity of 1.681 million 8-inch equivalent wafers in 2009, compared to 1.618 million units in 2008 and 1.448 million in 2007, according to the company's last quarterly report.

UMC has estimated a capex of US$1.2-1.5 billion for 2010, a significant rise from US$551 million allocated last year.

By: DocMemory
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