Friday, March 12, 2010
GlobalFoundries Inc. is planning to spend $2.5 billion to increase its 300-mm wafer manufacturing capacity by 50 percent in 2010, according to Udo Nothelfer, company vice president and general manager of Fab 1 in Dresden, Germany.
That would put the company's capital expenditure at about the same size as its pro forma revenue for 2009, the year of the company's formation as a merger of the manufacturing capabilities of Advanced Micro Devices Inc. (Sunnyvale, Calif.) and Singaporean foundry Chartered Semiconductor. It would also put GlobalFoundries hard on the heels of rival foundry Taiwan Semiconductor Manufacturing Co. Ltd. in terms of capex for 2010 and in fourth place for the whole of the semiconductor industry.
Global Foundries has two 300-mm wafer fabs and five 200-mm wafer fabs. It's most advanced fab is Fab 1 in Dresden inherited from AMD, which currently has a manufacturing capacity of about 30,000 wafer starts per month. Fab 7 in Singapore which came from Chartered is turning out about 37,000 wafers per month, Nothelfer said providing a total monthly 300-mm wafer capacity of 67,000 wafers per month. A 50 percent increase would take GlobalFoundries to about 100,000 wafers per month.
Nothelfer said that the plan was to Fab 7 to 50,000 wafers per month by 2011 and Fab 1 up to 60,000 wafers per month by mid-2012. The middle of 2012 is when the next wafer fab, Fab 8 under construction in New York state, is due to start running commercial wafers. That fab is projected to have a fully loaded capacity of 42,000 wafers per month.
By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved
|
