Elpida Memory is expected to outsource a total of 140,000 wafers a month to subsidiary Rexchip Electronics, Winbond Electronics and ProMOS Technologies at the end of 2010, a 40% rise compared to 100,000 wafers it currently purchases from its Taiwan-based partners.

Rexchip now supplies a DRAM output of 80,000 wafers per month to Elpida, followed by Powerchip Semiconductor Corporation (PSC) with 10,000-20,000 units and Winbond with 10,000. ProMOS will begin to mass produce DRAM chips, mainly DDR3, for the Japan-based vendor in July, the paper indicated.

Elpida CEO Yukio Sakamoto was quoted in previous reports saying the company's DRAM ties with Taiwan-based partners would remain close in the future. Elpida announced in late 2009 foundry partnerships with ProMOS and Winbond, in addition to its existing one with PSC.

By: DocMemory
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