Thursday, May 27, 2010
Taiwan Semiconductor Manufacturing Company (TSMC) has announced its 0.18-micron automotive embedded flash IP that passed AEC-Q100 product qualification requirements for a wide range of automotive applications, claiming it is the only foundry that provides AEC-Q100 qualified 0.25- and 0.18-micron embedded flash IP as general offers to all its customers.
TSMC said its 0.18-micron automotive embedded flash process entered initial volume production in 2009. More than 38,000 8-inch wafers, or an equivalent number of 43 million automotive MCU units, have been shipped.
TSMC claimed that so far it has observed lower failure rate as compared to the previous generation 0.25-micron, in which 0.1ppm or less is achieved.
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