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Elpida signed agreement to provide packaging technology


Monday, June 21, 2010

Taiwanese chip maker United Semiconductor Corp., memory-IC service provider Powertech Technology Inc., and Japan's DRAM producer Elpida Memory Inc. will sign an agreement for triangular technical cooperation on June 21, according to an industry source.

The three companies have maintained close cooperation in recent years. United Semiconductor, for example, licensed Elpida's embedded DRAM technology for use in advanced system-on-chip (SoC) solutions.

Last year, Taiwan's Powertech, a major memory backend supplier for chipmaker Elpida, invested 5 billion yen in Elpida's subsidiary ECM.

The two Taiwanese companies declined to reveal details about the cooperation deal but the source speculated it may be related to IC assembly and testing technology.

By: DocMemory
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