Wednesday, August 4, 2010
China-based foundry SMIC has shipped more than 10,000 65-nm wafers through its low-leakage 65nm process since the third quarter of 2009, successfully moving the node into volume production.
SMIC processes 65nm wafers at its 12-inch facility in Beijing, where capacity will be ramped up to 25,000 wafers a month by the end of 2010. The company has estimated its capex for 2010 at US$330 million, which will mainly be allocated to capacity expansions at its wafer fabs in Beijing and Shanghai.
In addition, SMIC revealed it is transitioning to a 55nm process, a 90% linear-shrink process from 65nm including I/O and analog circuits.
"SMIC's 65nm can take designs at 65nm and aim it toward the advantages of 55nm. I'm delighted with the progress of SMIC's 65/55nm project team which continues to meet rigorous deadlines," said Chris Chi, SMIC's senior VP and chief business officer.
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