Tuesday, August 10, 2010
Hynix Semiconductor has announced that it has begun mass producing 64Gb NAND flash chips using 20nm-class technology at its 12-inch M11 fab in Cheongju, South Korea.
Hynix said its 20nm-class process, which was developed in February, provides a 60% increase in productivity over its existing 30nm-class node. The 20nm-class 64Gb NAND doubles the density in a package over the current 32Gb product, meeting the needs of advanced mobile solutions which require smaller size and higher density storage capacity.
Hynix has also developed NAND flash solution products which combine its 30nm-class 32Gb chips and controller devices from Anobit, an Israeli NAND-based solution provider, through a strategic alliance between the two companies. The newly mass-produced 20nm-class NAND flash chips will also be combined with the controller device, and will be validated in September 2010.
"With these 20nm-class 64Gb chips, the company is enabled to provide customized, high performance products in a timely manner which perfectly suits mobile solutions including smartphones, table PCs and others," said SW Park, Executive VP and CTO of Hynix.
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